Shown with optional cabinet.

Reflow-oven 551.10

This in-line reflow oven affords non-polluting, lead free soldering of complex boards with components like QFP, BGA/CSPs. Optimal for processing small & medium batches.

The basic machine is constructed as a tabletop unit & disposes of the need for a heating chamber with 8 heating zones; in each case four on top/bottom. The heating zones emit convective heat with the help of a hot air blower.

The upper part of the heating chamber includes an additional cooling zone & an exhaust air bonnet in the lead-in & lead-out area. 

The soldering system is controlled by a modern 7” touch panel. A one-channel temperature sensor is integrated for controlling the contour of soldering on the PCB.

Model 160 Desktop Convection Reflow Solder Oven

PCBs are placed in the drawer on individually adjustable, magnetic, supports.  The mass & small contact area of the supports contributes to uniform heating.  The heating process is fully controlled by a microprocessor & ensures reliable & reproducible results.

Programming & operation are carried out from the clearly arranged keyboard.  All data entered by the user, & essential information of the operation of each process, is shown on the 2-line LCD display.